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Alloy Evaporation Materials DeselectAluminum silicon copper granule(Al-Cu-Si)essential information | |
Molecular formula | Al-Cu-Si |
purity | 99.99% |
CAS No | |
Molar mass | |
density | |
melting point | |
boiling point | |
Solubility (water) |
1-10mm
Aluminum silicon copper granule(Al-Cu-Si)Product application |
Aluminum and copper are usually used as interconnection materials in the production of integrated circuits. Compared with aluminum interconnects, high-purity aluminum copper interconnects have a more uniform internal microstructure, which can effectively improve the electromigration of interconnects and the process of diffusion to wafers. In the production of integrated circuits, silicon with saturated concentration is added to aluminum copper to form aluminum copper silicon alloy, so as to effectively improve the ubiquitous phenomenon of silicon diffusion to the interconnect layer.