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Element Evaporation Materials DeselectNickel granule(Ni)essential information | |
Molecular formula | Ni |
purity | 99.995% |
CAS No | 7440-02-0 |
Molar mass | 58.6934 |
density | 8.908 g·cm−3 |
melting point | 1455 °C |
boiling point | 2913 °C |
Solubility (water) |
Nickel is nearly silvery white, hard, ductile, ferromagnetic and has good corrosion resistance
Nickel granule(Ni)Product application |
Nickel metal film has good conductivity, corrosion resistance and plasticity, and is widely used in semiconductor and microelectronics industry. Nickel metal film is often used as the key material for making electrodes of MESFET devices. In industry, nickel films are often grown on heavily doped silicon substrates, and then annealed to form nickel-silicon compounds, thus reducing the resistivity of metal-semiconductor contact and improving device performance.