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Element Evaporation Materials DeselectAurum granule(Au)essential information | |
Molecular formula | Au |
purity | 99.99% |
CAS No | 7440-57-5 |
Molar mass | 196.97 |
density | 19.32g/cm³ |
melting point | 1063.69 至 1069.74 ℃ |
boiling point | 2530 至 2947 ℃ |
Solubility (water) | Insoluble in water |
Aurum granule(Au)Product application |
Au thin film has good conductivity and chemical inertness, and is widely used in semiconductors, MEMS, biosensors and other fields. It has low resistivity and high chemical stability, and is often used in leads and electrodes of various devices. In order to reduce the difference of thermal expansion coefficient between Au film and substrate material, Cr film is usually used as the main transition layer between Au film and substrate material. The stability of Cr/Au thin film heterostructure has a direct impact on the device performance.