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Tungsten sputtering target(W)

Tungsten sputtering target(W)
  • Tungsten sputtering target(W)
Tungsten sputtering target(W)essential information
Molecular formulaW
purity99.95%
CAS No7440-33-7
Molar mass183.84
density19.35 g/cm³
melting point3410 ℃
boiling point5660 ℃
Solubility (water)

Tungsten sputtering target(W)Product overview

There are two variants of tungsten, α and β。 At standard temperature and atmospheric pressure, α Type B is a stable body centered cubic structure. β Type tungsten can only appear in the presence of oxygen. It is stable below 630 ℃ and converts to α Tungsten, and this process is irreversible.


Tungsten is a rare high melting point metal that can improve the high-temperature hardness of steel. Tungsten is a silvery white metal that resembles steel in appearance. Tungsten has a high melting point, low vapor pressure, and low evaporation rate. "The chemical properties of tungsten are very stable, and it does not react with air and water at normal temperatures. When not heated, hydrochloric acid, sulfuric acid, nitric acid, hydrofluoric acid, and aqua regia of any concentration have no effect on tungsten. When the temperature rises to 80 ° - 100 ° C, among the above acids, except hydrofluoric acid, other acids have a weak effect on tungsten.". At room temperature, tungsten can be rapidly dissolved in a mixture of hydrofluoric acid and concentrated nitric acid, but it does not function in alkaline solutions. In the presence of air, molten alkali can oxidize tungsten to tungstate. In the presence of oxidants (NaNO3, NaNO2, KClO3, PbO2), the reaction to form tungstate is more intense. It can combine with oxygen, fluorine, chlorine, bromine, iodine, carbon, nitrogen, sulfur, etc. at high temperatures, but not with hydrogenation

Tungsten sputtering target(W)Product application

For semiconductor wires and electronic devices

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