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Element Sputtering Targets DeselectTitanium sputtering targets(Ti)essential information | |
Molecular formula | Ti |
purity | 99.9% |
CAS No | 7440-32-6 |
Molar mass | 47.867 |
density | 4.506 g·cm−3 |
melting point | 1941 K,1668 °C,3034 °F |
boiling point | 3560 K,3287 °C,5949 °F |
Solubility (water) |
Titanium sputtering targets(Ti)Product application |
High purity titanium is mainly used as a semiconductor material and as a getter material in ultra-high vacuum devices. High purity titanium has the ability to absorb gas, especially hydrogen, CH4, and Co2 gases, so it can be widely used in high vacuum and ultra-high vacuum systems. When using high-purity titanium sputtering to fabricate circuit networks, these integrated components can be made exceptionally light, thin, small in size, and circuit dense. High purity titanium targets can also be used as barrier metal materials.