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Titanium sputtering targets(Ti)

Titanium sputtering targets(Ti)
  • Titanium sputtering targets(Ti)
Titanium sputtering targets(Ti)essential information
Molecular formulaTi
purity99.9%
CAS No7440-32-6
Molar mass47.867
density4.506 g·cm−3
melting point1941 K,1668 °C,3034 °F
boiling point3560 K,3287 °C,5949 °F
Solubility (water)

Titanium sputtering targets(Ti)Product overview

Titanium sputtering targets(Ti)Product application

High purity titanium is mainly used as a semiconductor material and as a getter material in ultra-high vacuum devices. High purity titanium has the ability to absorb gas, especially hydrogen, CH4, and Co2 gases, so it can be widely used in high vacuum and ultra-high vacuum systems. When using high-purity titanium sputtering to fabricate circuit networks, these integrated components can be made exceptionally light, thin, small in size, and circuit dense. High purity titanium targets can also be used as barrier metal materials.

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